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| DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT PC1687G/GV GENERAL PURPOSE 5 V FREQUENCY DOWN-CONVERTER IC DESCRIPTION The PC1687 is Silicon monolithic IC designed for UHF band receiver applications. This IC consists of double balanced mixer, local oscillator, IF amplifier, and voltage regulator. The package is 8-pin SOP or SSOP suitable for high-density surface mount. FEATURES * UHF band operation * Single-end push-pull IF amplifier suppresses fluctuation in output impedance. * Good capability of UHF-varactor diode due to balanced amplifier oscillator * Supply voltage: 5 V * Packaged in 8-pin SOP or SSOP suitable for high-density mounting APPLICATIONS * Tuners for TV and VCR * Receivers for UHF band ORDERING INFORMATION Part Number Package 8-pin plastic SOP (225 mil) Package Style Embossed tape 12 mm wide. Pin 1 indicates pull-out direction of tape. Qty 2.5 kp/reel. Embossed tape 12 mm wide. Pin 1 indicates roll-in direction of tape. Qty 2.5 kp/reel. 8-pin plastic SSOP (175 mil) Embossed tape 8 mm wide. Pin 1 indicates pull-out direction of tape. Qty 1 kp/reel. PC1687G-E1 PC1687G-E2 PC1687GV-E1 Remark To order evaluation samples, please contact your local NEC office. (Part number for sample order: PC1687G, PC1687GV) Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P11101EJ4V0DS00 (4th edition) Date Published October 1999 N CP(K) Printed in Japan The mark shows major revised points. (c) 1996, 1999 PC1687G/GV INTERNAL BLOCK DIAGRAM 8 7 6 IF Main Amp. IF Pre Amp. OSC OSC Buffer MIX 5 PIN CONFIGURATION (Top View) 1. OSC base (bypass) 1 2 3 4 REG. 8 7 6 5 2. OSC base (feedback) 3. OSC collector (coupling) 4. VCC 5. IF output 6. GND 7. RF input1 (bypass) 8. RF input2 1 2 3 4 2 Data Sheet P11101EJ4V0DS00 PC1687G/GV PIN EXPLANATION Pin No. 1 Symbol OSC base (bypass) Function and Explanation Internal oscillator consists in balance amplifier. 2 pin and 3 pin should be externally equiped with tank resonater circuit in order to oscillate with feedback loop. 1 pin should be grounded through coupling capacitor to 5 pF. 3 pin is defined as open collector. This pin should be coupled through resistor or chock coil in order to adjust Q and be supplied voltage. In case of abnormal oscillation, adjust its Q lower to stabilize the operation. Equivalent Circuit 3 VCC 1 2 2 OSC base (feedback) to OSC buffer amp. VREF 3 OSC collector (coupling) 4 5 VCC IF output Supply voltage pin for the IC. IF output pin. IF amplifier is designed as singleend push-pull amplifier. This pin is assigned for the emitter follower output with 50 constant resistive impedance in wide band. from IF pre amp. 5 IF output VCC 6 7 GND RF input 1 (bypass) GND pin for the IC. 7 pin and 8 pin are inputs for mixer designed as double balanced type. Either pin can be assigned for input and another for ground. VCC to IF amp. 8 RF input 2 from OSC buffer RF input Data Sheet P11101EJ4V0DS00 3 PC1687G/GV ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Power Dissipation Operating Ambient Temperature Storage Temperature Symbol VCC PD TA Tstg TA = +25 C TA = +85 C Note Conditions Rating 6.0 250 -40 to +85 -65 to +150 Unit V mW C C Note Mounted on 50 x 50 x 1.6-mm epoxy glass PWB, with copper patterning on both sides. RECOMMENDED OPERATING RANGE Parameter Supply Voltage Operating Ambient Temperature Symbol VCC TA MIN. 4.5 -40 TYP. 5.0 +25 MAX. 5.5 +85 Unit V C ELECTRICAL CHARACTERISTICS (VCC = 5 V, TA = +25 C) Parameter Circuit Current 1 Conversion Gain 1 Symbol ICC1 CG1 Test Conditions No input signal Note MIN. 25 22 TYP. 38 26 MAX. 48 29 Unit mA dB fRF = 500 MHz, fIF = 50 MHz, PRF = -40 dBm, POSC = -5 dBm Note fRF = 900 MHz, fIF = 50 MHz, PRF = -40 dBm, POSC = -5 dBm Note fRF = 500 MHz, fIF = 50 MHz, POSC = -5 dBm fRF = 900 MHz, fIF = 50 MHz, POSC = -5 dBm Conversion Gain 2 CG2 20 - 24 27 dB Noise Figure 1 NF1 9 12 dB Note - Note - - +10 +10 - - dBm 10 13 dB Noise Figure 2 NF2 Maximum Output Power 1 PO(sat)1 fRF = 500 MHz, fIF = 50 MHz, PRF = 0 dBm, POSC = -5 dBm Note fRF = 900 MHz, fIF = 50 MHz, PRF = 0 dBm, POSC = -5 dBm Note Maximum Output Power 2 PO(sat)2 dBm Note By test circuit 1 4 Data Sheet P11101EJ4V0DS00 PC1687G/GV STANDARD CHARACTERISTICS (FOR REFERENCE) (VCC = 5 V, TA = +25 C unless otherwise specified) Parameter Oscillation Frequency Stability Oscillation Frequency Drift Oscillation Start Voltage 1 % Cross-modulation Distortion 1 1 % Cross-modulation Distortion 2 Symbol fstb fdrift VOSC CM1 CM2 Test Conditions VCC = 10 %, fOSC = 550 to 950 MHz fOSC = 550 to 950 MHz, 30 min. fOSC = 550 to 950 MHz fRF = 500 MHz fRF = 900 MHz Note 1 Note 1 Note 1 Note 2, 3 Note 2, 3 Reference Values 200 150 3.0 88 89 Unit kHz kHz V dB dB Notes 1. By test circuit 2 2. By test circuit 1 3. fundes = fRF 12 MHz, PRF = -31 dBm, fIF = 50 MHz, POSC = -5 dBm AM: 100 kHz, 30 % Mod., S/I Ratio = 46 dBc, output 75 open Data Sheet P11101EJ4V0DS00 5 PC1687G/GV TYPICAL CHARACTERISTICS (TA = +25 C) CIRCUIT CURRENT VS. SUPPLY VOLTAGE No Input Signal 50 Circuit Current ICC (mA) 40 30 20 10 0 1 2 3 4 5 6 Supply Voltage VCC (V) NOISE FIGURE AND CONVERSION GAIN VS. INPUT FREQUENCY 16 CG 14 Conversion Gain CG (dB) Noise Figure NF (dB) 25 12 20 10 15 NF 10 8 6 5 VCC = 5 V, f IF = 50 MHz, RF Input Terminal: No Tuned, PRF = -40 dBm, POSC = -5 dBm 0 500 Input Frequency fRF (MHz) 1 000 1 200 6 Data Sheet P11101EJ4V0DS00 PC1687G/GV CONVERSION GAIN VS. INPUT FREQUENCY 30 Conversion Gain CG (dB) 25 20 15 10 5 VCC = 5 V, PRF = -40 dBm, fIF = 50 MHz, POSC = -5 dBm RF Input Terminal: Tuned 55 200 500 Input Frequency fRF (MHz) 900 1 % CROSS-MODULATION DISTORTION VS. INPUT FREQUENCY 1 % Cross-modulation Distortion CM (dB) 100 90 80 70 60 VCC = 5 V fundes = fRF 12 MHz PRF = -31 dBm fIF = 50 MHz POSC = -5 dBm AM: 100 kHz, 30 % Mod. S/I Ratio = 46 dBc Output Port: 75 Open 500 Input Frequency fRF (MHz) 1 000 1 200 0 Data Sheet P11101EJ4V0DS00 7 PC1687G/GV OUTPUT POWER VS. INPUT POWER +30 Output Power Pout (dBm) Pout 0 IM3 VCC = 5 V fIF = 50 MHz fRF = 900 MHz POSC = -5 dBm -40 0 Input Power Pin (dBm) +20 OSC-FREQUENCY STABILITY VS. OSC-FREQUENCY +300 Oscillation Frequency Stability Fstb (kHz) VCC 10 % VCC -10 % 0 VCC +10 % -300 0 500 Oscillation Frequency fOSC (MHz) 1 000 1 200 8 Data Sheet P11101EJ4V0DS00 PC1687G/GV TEST CIRCUIT 1 OSC Input VCC 47 150 nH 1 000 pF 4 5 1 000 pF IF Output 4 pF 1 000 pF RF Input 1 000 pF 3 6 2 7 1 8 5 pF 1 000 pF TEST CIRCUIT 2 ZO = 200 47 k 4 pF VCC 47 150 nH 5 pF 1 000 pF 4 5 1 000 pF IF Output 4 pF 1 000 pF RF Input 1 000 pF 3 6 2 7 1 8 4 pF 10 pF HVU202 = 20 mm BT 0.5 pF Data Sheet P11101EJ4V0DS00 9 PC1687G/GV APPLICATION CIRCUIT EXAMPLE ZO = 200 47 k 4 pF VCC 47 150 nH 5 pF 1 000 pF 4 5 1 000 pF IF Output 4 pF 1 000 pF RF Input 3 6 2 7 1 8 4 pF 10 pF HVU202 = 20 mm BT 0.5 pF 10 Data Sheet P11101EJ4V0DS00 PC1687G/GV PACKAGE DIMENSIONS 8 PIN PLASTIC SOP (225 mil) (UNIT: mm) 8 5 detail of lead end 3-3 +7 1 5.2 0.2 4 6.5 0.3 1.57 0.2 1.49 4.4 0.15 1.1 0.2 0.85 MAX. 1.27 0.42 -0.07 0.1 0.1 +0.08 0.6 0.2 0.17 -0.07 +0.08 0.10 0.12 M NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. Data Sheet P11101EJ4V0DS00 11 PC1687G/GV 8 PIN PLASTIC SSOP (175 mil) (UNIT: mm) 8 5 detail of lead end 3-3 +7 1 3.00 MAX 4 4.94 0.2 1.8 MAX 1.5 0.1 3.2 0.1 0.87 0.2 0.575 MAX. 0.65 0.3 -0.05 0.1 0.1 +0.10 0.5 0.2 0.15 -0.05 +0.10 0.15 0.10 M NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. 12 Data Sheet P11101EJ4V0DS00 PC1687G/GV NOTE ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). (3) Keep the track length of the ground pins as short as possible. (4) Connect a bypass capacitor (example: 1 000 pF) to the VCC pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235 C or below Time: 30 seconds or less (at 210 C) Note Count: 3, Exposure limit: None Package peak temperature: 215 C or below Time: 40 seconds or less (at 200 C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260 C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300 C Time: 3 seconds or less (per side of device) Note Exposure limit: None Recommended Condition Symbol IR35-00-3 VPS VP15-00-3 Wave Soldering WS60-00-1 Partial Heating - Note After opening the dry pack, keep it in a place below 25 C and 65 % RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Data Sheet P11101EJ4V0DS00 13 PC1687G/GV [MEMO] 14 Data Sheet P11101EJ4V0DS00 PC1687G/GV [MEMO] Data Sheet P11101EJ4V0DS00 15 PC1687G/GV NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. * The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8 |
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